Chen, S. Et Al. 2022. Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills. CONSTRUCTION AND BUILDING MATERIALS , vol.360 .

Chen, S., Yılmaz, E., Wang, W., & Wang, Y., (2022). Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills. CONSTRUCTION AND BUILDING MATERIALS , vol.360.

Chen, Shun-Man Et Al. "Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills," CONSTRUCTION AND BUILDING MATERIALS , vol.360, 2022

Chen, Shun-Man Et Al. "Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills." CONSTRUCTION AND BUILDING MATERIALS , vol.360, 2022

Chen, S. Et Al. (2022) . "Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills." CONSTRUCTION AND BUILDING MATERIALS , vol.360.

@article{article, author={Shun-Man Chen Et Al. }, title={Curing stress effect on stability, microstructure, matric suction and electrical conductivity of cementitious tailings backfills}, journal={CONSTRUCTION AND BUILDING MATERIALS}, year=2022}