Köklü, U. Et Al. 2025. Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. Applied Sciences (Switzerland) , vol.15, no.1 .

Köklü, U., Tazegül, A. S., Serin, F., & Basmacı, G., (2025). Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution. Applied Sciences (Switzerland) , vol.15, no.1.

Köklü, Uğur Et Al. "Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution," Applied Sciences (Switzerland) , vol.15, no.1, 2025

Köklü, Uğur Et Al. "Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution." Applied Sciences (Switzerland) , vol.15, no.1, 2025

Köklü, U. Et Al. (2025) . "Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution." Applied Sciences (Switzerland) , vol.15, no.1.

@article{article, author={Uğur Köklü Et Al. }, title={Investigation of the Effects of Wafer-Baking Plates on Thermal Distribution, Wafer Thickness, and Wafer Color Distribution}, journal={Applied Sciences (Switzerland)}, year=2025}