Cutting-fluid flow with chip evacuation during deep-hole drilling with twist drills


Baumann A., ÖZKAYA E., Schnabel D., Biermann D., Eberhard P.

EUROPEAN JOURNAL OF MECHANICS B-FLUIDS, cilt.89, ss.473-484, 2021 (SCI-Expanded) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 89
  • Basım Tarihi: 2021
  • Doi Numarası: 10.1016/j.euromechflu.2021.07.003
  • Dergi Adı: EUROPEAN JOURNAL OF MECHANICS B-FLUIDS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Aquatic Science & Fisheries Abstracts (ASFA), Communication Abstracts, INSPEC, Metadex, zbMATH, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.473-484
  • Recep Tayyip Erdoğan Üniversitesi Adresli: Hayır

Özet

In this study the important aspects of cutting fluid distribution and the chip evacuation during micro twist deep-hole drilling are investigated using 3D multi-physics simulation methods. A coupled particle simulation is performed to analyze the chip transport by combining Smoothed Particle Hydrodynamics and the Discrete Element Method. Therefore, the transient transport of the chips is compared to a simulation scenario without chips. The coupled particle approach is capable to deal with free surfaces and fluid-solid interactions, that are subject to major topological changes over time. The chip positions resulting from the coupled particle simulation are used to carry out a Computational Fluid Dynamics simulation which considers the physical boundary conditions of the fluid and the process parameters to perform in-depth flow analyses. The results show good qualitative agreement between both simulation methods. Furthermore, the results show that large dead-zones with no fluid or almost zero fluid velocity exist in the flutes and that the chips there only experience a small evacuation force from the cutting fluid. The presented coupled approach of combining CFD and SPH-DEM simulation provide a significant support for future investigations to research the chip transport and to improve the tools and the process further. (C) 2021 The Authors. Published by Elsevier Masson SAS.