HIGH TEMPERATURE MATERIALS AND PROCESSES, vol.29, no.4, pp.287-294, 2010 (SCI-Expanded)
In this study, a detailed account is given of how urea formaldehyde adhesives with different mole ratios, panel density, shelling ratio and waste screen dust addition Influence the physical and mechanical properties, and formaldehyde emission of particleboard panels The experimental results showed that formaldehyde emission decreased with decreasing formaldehyde/urea mole ratio and shelling ratio, and waste screen dust addition The modulus of rupture, modulus of elasticity and internal bond strength and thickness swelling of the test panels improved with increasing mole ratio, panel density and shelling ratio, and waste screen dust addition However, increasing panel density negatively affected formaldehyde emission