Influence of a short-time antioxidant application on the dentin bond strength after intracoronal bleaching

Karadas M., DEMİRBUĞA S.

MICROSCOPY RESEARCH AND TECHNIQUE, vol.82, no.10, pp.1720-1727, 2019 (SCI-Expanded) identifier identifier identifier

  • Publication Type: Article / Article
  • Volume: 82 Issue: 10
  • Publication Date: 2019
  • Doi Number: 10.1002/jemt.23337
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1720-1727
  • Recep Tayyip Erdoğan University Affiliated: Yes


This study evaluated the effects of an antioxidant application on the compromised bond strength of an adhesive to dentin bleached with 35% hydrogen peroxide. The dentin surfaces of the pulp chambers of 70 human third molars were ground, and the specimens were assigned randomly into seven groups, as follows: (a) control (unbleached); (b) bleached for 45 min, bonded immediately; (c) bleached for 45 min, treated with sodium ascorbate (SA) for 2 min, and bonded; (d) bleached for 45 min, bonded after 2 weeks; (e) bleached for 12 days, bonded immediately; (f) bleached for 12 days, treated with SA for 10 min, and bonded; and (g) bleached for 12 days, bonded after 2 weeks. In each group, the multimode adhesive was applied in etch-and-rinse and self-etch modes. The dentin surfaces were covered with a resin-based composite, and the bonded specimens were sectioned to produce composite-dentin sticks. The sticks were attached to a testing machine and subjected to a tensile force, and the representative specimens were examined via scanning electron microscopy. The bond strength was not affected by the application period of the bleaching agent. Both bleaching treatments significantly reduced the bond strength to the dentin in the self-etch or etch-and-rinse mode when compared with the control group. The bond strengths returned to normal levels with the SA applications or by waiting 2 weeks, regardless of the application period of the bleaching gel. The adhesive revealed a higher bond strength in the etch-and-rinse mode than in the self-etch mode.