Akademik Veri Yönetim Sistemi
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, cilt.14, sa.6, ss.965-972, 2024 (SCI-Expanded)
Suspended finite ground coplanar waveguide (FG-CPW) interconnects, fabricated with laser-enhanced direct print additive manufacturing (AM), are modeled and characterized in this work. The study focuses on the variation of characteristic impedance and attenuation with design geometry. Acrylonitrile butadiene styrene (ABS) is printed with fused deposition modeling (FDM) to form 10-mm-long suspended ABS bridges and Dupont CB028 is microdispensed to realize conductive traces on the ABS bridges. Femtosecond pulsed laser machining in the ultraviolet range is combined with the AM to create gaps ranging from 8 to 92 $\mu $ m in width on either side of a signal line to define the FG-CPW. Three different suspended interconnects are designed, where the total linewidth (signal line plus gaps) is kept constant at 300 $\mu $ m for all designs, but the aspect ratio (AR) (signal linewidth divided by total linewidth) is varied. Two multiline thru-reflect-line calibrations are performed to measure each design: one uses printed calibration standards and the other employs a commercial calibration substrate. The attenuation of the interconnects at 30 GHz is 0.28, 0.13, and 0.06 dB/mm for ARs of 0.95, 0.87, and 0.38, respectively. The laser machining of the gaps results in partial substrate removal, which increases the characteristic impedance by approximately 11%. The impact of fabrication tolerances is examined.