Investigation of adhesive thickness and overlap length in single-lap bonded assemblies
ADVANCES IN NANO RESEARCH, cilt.21, sa.1, ss.45-57, 2026 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 21 Sayı: 1
- Basım Tarihi: 2026
- Doi Numarası: 10.12989/anr.2026.21.1.045
- Dergi Adı: ADVANCES IN NANO RESEARCH
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Compendex
- Sayfa Sayıları: ss.45-57
- Recep Tayyip Erdoğan Üniversitesi Adresli: Evet
Özet
Bonded assembly is a widely used technique especially in the aerospace industry. This work aims to study the behavior of a bonded assembly-type metal/metal under tensile loading. A numerical investigation with the code (FEM Abaqus) was carried out to evaluate the resistance of a single-lap adhesive-bonded joint, highlighting several parameters namely: loading, thickness of adhesive, and overlap length. The geometric model for the singlelap adhesive-bonded joint used is made of two thin steel plates, with different adhesive types. The results obtained by the finite element method show that the optimum overlap length (O-L = 10 mm) is the length of the adhesive that allows it withstand a maximum force for a minimum adhesive surface.