How do increased irradiance and exposure time affect the repair bond strength of universal adhesives to CAD-CAM composite material?
JOURNAL OF ORAL SCIENCE, cilt.68, sa.3, ss.119-123, 2026 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 68 Sayı: 3
- Basım Tarihi: 2026
- Doi Numarası: 10.2334/josnusd.25-0300
- Dergi Adı: JOURNAL OF ORAL SCIENCE
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, CINAHL, MEDLINE, Biomedical Reference Collection: Corporate Edition (EBSCO)
- Sayfa Sayıları: ss.119-123
- Açık Arşiv Koleksiyonu: AVESİS Açık Erişim Koleksiyonu
- Recep Tayyip Erdoğan Üniversitesi Adresli: Evet
Özet
Purpose: This study was designed to investigate the effects of increased exposure time and different levels of irradiance on the repair bond strength (& micro;TBS) and degree of conversion (DoC) of two universal adhesives. Methods: Computer-aided design-computeraided manufacturing (CAD-CAM) composite blocks were prepared and subjected to thermal cycling. They were randomly divided into two groups based on the adhesive agent used: Clearfil S-3 Bond Universal (CSU) or Gluma Bond Universal (GBU). Within each group, the specimens were further classified into six subgroups (n = 6 blocks) according to irradiance (1,000 or 1,400 mW/ cm(2)) and exposure time (10, 15, or 20 s). The bonded specimens were then repaired using nano-hybrid resin composite. Sticks measuring 0.9 mm(2) were obtained from the repaired blocks and subsequently tested in a micro-tensile testing machine. Additionally, the DoC was assessed using micro-Raman spectroscopy. Results: The 1400*10 group of GBU and CSU demonstrated higher & micro;TBS than the 1000*10 and 1400*15 groups, regardless of thermal cycling (P = 0.000). For CSU, the 1400*10 group showed the highest DoC (P < 0.05). However, the DoC of GBU did not differ significantly among the various irradiation/exposure times (P > 0.05). Conclusion: The polymerization of adhesives at an irradiance level of 1,400 mW/cm2 for 10 s (14 J/cm2) increases the repair & micro;TBS and DoC regardless of thermal cycling.