Numerical analysis of the receding contact problem of two bonded layers resting on an elastic half plane

Yaylaci M., TERZİ C., AVCAR M.

STRUCTURAL ENGINEERING AND MECHANICS, cilt.72, sa.6, ss.775-783, 2019 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 72 Sayı: 6
  • Basım Tarihi: 2019
  • Doi Numarası: 10.12989/sem.2019.72.6.775
  • Dergi Adı: STRUCTURAL ENGINEERING AND MECHANICS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.775-783
  • Anahtar Kelimeler: contact mechanics, numerical analysis, normal stress, shear stress, FINITE ELEMENT METHOD, SIO2 NANOPARTICLES, FREE-VIBRATION, COMPUTATIONAL MODEL, SHEAR DEFORMATION, SOLID BODIES, CRACK, PLATES, APPLICABILITY
  • Recep Tayyip Erdoğan Üniversitesi Adresli: Evet

Özet

The present study deals with the numerical analysis of the symmetric contact problem of two bonded layers resting on an elastic half plane compressed with a rigid punch. In this context, Finite Element Method (FEM) based software called ANSYS and ABAQUS are used. It is assumed that the elastic layers have different elastic constants and heights and the external load is applied to the upper elastic layer by means of a rigid stamp. The problem is solved under the assumptions that the contact between two elastic layers, and between the rigid stamp are frictionless, the effect of gravity force is neglected. To validate the constructed model and obtained results a comparison is performed with the analytical results in literature. The numerical results for normal stresses and shear stresses are obtained for various parameters of load, material and geometry and are tabulated and illustrated.