A comparison of piezosurgery and conventional surgery by heat shock protein 70 expression


Gülnahar Y., Hüseyin Köşger H., TUTAR Y.

International Journal of Oral and Maxillofacial Surgery, cilt.42, sa.4, ss.508-510, 2013 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 42 Sayı: 4
  • Basım Tarihi: 2013
  • Doi Numarası: 10.1016/j.ijom.2012.10.027
  • Dergi Adı: International Journal of Oral and Maxillofacial Surgery
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.508-510
  • Anahtar Kelimeler: cell repair, Hsp70, maxillofacial surgery, piezosurgery, stress indicator, third molar teeth
  • Recep Tayyip Erdoğan Üniversitesi Adresli: Hayır

Özet

The effects of mechanical instruments on the viability of cells are essential in terms of regeneration. There is considerable interest in cell repair following damage mediated by dental surgical procedures. Cells can tolerate stress by expressing heat shock protein 70 (Hsp70). During and after surgical tooth removal, oxidative stress can activate Hsp70 expression proportional to the intensity of the stress signal stimulus to cope with stress. This study examined the expression of Hsp70 as a potential biomarker of immediate postoperative stress in patients undergoing two different surgical procedures of different severity. Expression of Hsp70 both at mRNA and at protein level in the conventional group was two-fold higher than that of the piezo group. This suggests that tooth movement by the piezo method causes relatively lower stress in the alveolar bone. Piezosurgery provides relatively low stress to the patients and this may help cell repair after the surgical procedure. Patients undergoing more aggressive surgery using conventional methods showed a significant increase in Hsp70 in the immediate postoperative period. Therefore, Hsp70 induction can be a potential tool as a prognostic surgical marker. © 2012 International Association of Oral and Maxillofacial Surgeons.